Triphenylsulfonium salt with 1-(tricyclo[3.3.1.13,7]dec-1-ylmethyl) 2,2-difluoro-2-sulfoacetate (1:1) CAS#: 1022939-88-3; ChemWhat Code: 1491748

Triphenylsulfonium salt with 1-(tricyc

IdentificationPhysical DataSpectra
Route of Synthesis (ROS)Safety and HazardsOther Data

Identification

Product NameTriphenylsulfonium salt with 1-(tricyclo[3.3.1.13,7]dec-1-ylmethyl) 2,2-difluoro-2-sulfoacetate (1:1)
IUPAC Name2-(1-adamantylmethoxy)-1,1-difluoro-2-oxoethanesulfonate;triphenylsulfanium
Molecular StructureStructure of Triphenylsulfonium salt with 1-(tricyclo[3.3.1.13,7]dec-1-ylmethyl) 2,2-difluoro-2-sulfoacetate (11) CAS 1022939-88-3
CAS Registry Number 1022939-88-3
EINECS NumberNo data available
MDL NumberNo data available
Beilstein Registry NumberNo data available
Synonymstriphenylsulfonium 1-adamantylmethoxycarbonyldifluoromethanesulfonatetriphenylsulfonium 1-adamantylmethoxycarbonyldifluoromethansulfonatetriphenylsulfonium (adamantan-1-ylmethyl)oxycarbonyldifluoromethanesulfonatetriphenylsulfonium (adamantane-1-ylmethyl)oxycarbonyldifluoromethanesulfonate
Molecular FormulaC31H32F2O5S2
Molecular Weight586.7
InChIInChI=1S/C18H15S.C13H18F2O5S/c1-4-10-16(11-5-1)19(17-12-6-2-7-13-17)18-14-8-3-9-15-18;14-13(15,21(17,18)19)11(16)20-7-12-4-8-1-9(5-12)3-10(2-8)6-12/h1-15H;8-10H,1-7H2,(H,17,18,19)/q+1;/p-1
InChI KeyOPUSNKQMMLRYMS-UHFFFAOYSA-M
Canonical SMILESC1C2CC3CC1CC(C2)(C3)COC(=O)C(F)(F)S(=O)(=O)[O-].C1=CC=C(C=C1)[S+](C2=CC=CC=C2)C3=CC=CC=C3
Patent Information
Patent IDTitlePublication Date
US2016/168115SALT, ACID GENERATOR, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN2016
 JP2018/145179SALT, ACID GENERATOR, RESIST COMPOSITION, AND METHOD FOR PRODUCING RESIST PATTERN2018

Physical Data

AppearanceWhite to off-white powder
SolubilityNo data available
Flash PointNo data available
Refractive indexNo data available
SensitivityNo data available

Spectra

Nucleus (NMR Spectroscopy)Solvents (NMR Spectroscopy)Original Text (NMR Spectroscopy)
1Hchloroform-d11H NMR (measurement solvent: deuterium chloroform, reference material: tetramethylsilane); δ=7.72 (m, 15H; TPS), 3.85 (s, 2H; CH2), 1.92 (m, 3H; 1-Ad), 1.62 (m, 12H; 1-Ad).
1Hchloroform-d119F NMR (measurement solvent: deuterium chloroform, reference material: trichlorofluoromethane); δ=-110.0 (s, 2F; CF2).
Description (Mass Spectrometry)Comment (Mass Spectrometry)Peak
ESI (Electrospray ionisation), LCMS (Liquid chromatography mass spectrometry)Molecular peak
ESI (Electrospray ionisation)Molecular peak263.2 m/z
LCMS (Liquid chromatography mass spectrometry), ESI (Electrospray ionisation)
LCMS (Liquid chromatography mass spectrometry), ESI (Electrospray ionisation)
Description (UV/VIS Spectroscopy)
Spectrum

Route of Synthesis (ROS)

Route of Synthesis (ROS) of Triphenylsulfonium salt with 1-(tricyclo[3.3.1.13,7]dec-1-ylmethyl) 2,2-difluoro-2-sulfoacetate (11) CAS# 1022939-88-3
Route of Synthesis (ROS) of Triphenylsulfonium salt with 1-(tricyclo[3.3.1.13,7]dec-1-ylmethyl) 2,2-difluoro-2-sulfoacetate (11) CAS# 1022939-88-3
ConditionsYield
In water at 80℃;100%
In methanol; water for 15h;

Safety and Hazards

GHS Hazard StatementsNot Classified

Other Data

TransportationNONH for all modes of transport
Under the room temperature and away from light
HS CodeNo data available
StorageUnder the room temperature and away from light
Shelf Life2 years
Market PriceUSD
Druglikeness
Lipinski rules component
Molecular Weight586.721
logP8.553
HBA5
HBD0
Matching Lipinski Rules2
Veber rules component
Polar Surface Area (PSA)91.88
Rotatable Bond (RotB)8
Matching Veber Rules2
Use Pattern
Core Function: Photoacid Generator (PAG)
It absorbs light and undergoes photolytic cleavage
Produces a strong acid (difluoromethanesulfonic acid)
The generated acid can catalyze chemically amplified reactions or initiate subsequent cationic polymerization. It is a key functional additive in photoresist and cationic photopolymer curing systems.
II. Main Application Areas
1.Semiconductor Photoresists (Chemically Amplified Photoresists, CARs)
Applicable to:
i-line, KrF, and ArF lithography systems
High-resolution chemically amplified photoresists
Main functions:
Acid generation upon exposure
Catalyzes deprotection reactions
Amplifies exposure effects → improves resolution, sensitivity, and critical dimension / line edge roughness (CD/LER) control
Advantages of the adamantyl structure:
Provides high thermal stability
Reduces acid diffusion → improves resolution and line edge roughness
Enhances optical performance and formulation stability of photoresists
Cationic Photocuring Systems
Used in UV-induced cationic curing of epoxy resins and vinyl ether materials
UV irradiation → acid generation → initiates cationic ring-opening polymerization or crosslinking
Applications include:
UV-curable coatings and inks
Electronic encapsulation materials
Photo-patternable insulating layers (e.g., PSPI, PI)

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